Development of Advanced Packaging Technology
Release time:
2024-05-28
In recent years, science and technology lead life, and more and more affect all aspects of people's lives. The development of science and technology is inseparable from the continuous iterative update of semiconductor industry technology. In order to design more functions in the same volume of components, the chip size requires more and more miniaturization, while ensuring low power consumption, high stability and other high performance.
In recent years, science and technology lead life, and more and more affect all aspects of people's lives. The development of science and technology is inseparable from the continuous iterative update of semiconductor industry technology. In order to design more functions in the same volume of components, the chip size requires more and more miniaturization, while ensuring low power consumption, high stability and other high performance.
For a long time, the improvement of chip performance is mainly achieved through technological breakthroughs, and this approach is becoming more and more difficult, and the improvement of packaging performance is becoming more and more important as an effective supplement.
Q What is an advanced package?
A advanced packaging is an effective integration and reconfiguration at the chip package level, integrating more functional units per unit volume, and these units are highly dense and short interconnected, thus achieving miniaturization, high performance, and low power consumption of the device. The current advanced packaging mainly includes WLCSP,Chiplets,FO CSP, as well as 2.5D integration through intermediate media such as silicon conversion boards and 3D integration through direct TSV electrical connection of chips. Therefore, from the perspective of the appearance of the device, the development of advanced packaging, one is the ultra-small and ultra-thin represented by the small chip, and the other is the ultra-thin and large package represented by the integrated package.
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