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Tapes

UV Cutting Tape
It is a tape used in cutting process of various silicon wafers,package substrates,glass and crystal components.It is easier to peel off by reducing the adhesive force with ultraviolet ray.
Details 白箭头 黑箭头
Laminated Tape
It is a tape to protect the front of silicon wafer with circuits in the grinding process.In the concept of adhesive free from cleaning,it has low dust and stable grinding performance.
Details 白箭头 黑箭头
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