
Products
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Tapes
UV Cutting Tape
It is a tape used in cutting process of various silicon wafers,package substrates,glass and crystal components.It is easier to peel off by reducing the adhesive force with ultraviolet ray.


Laminated Tape
It is a tape to protect the front of silicon wafer with circuits in the grinding process.In the concept of adhesive free from cleaning,it has low dust and stable grinding performance.


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