Products
.
Tapes
UV Cutting Tape
It is a tape used in cutting process of various silicon wafers,package substrates,glass and crystal components.It is easier to peel off by reducing the adhesive force with ultraviolet ray.
Laminated Tape
It is a tape to protect the front of silicon wafer with circuits in the grinding process.In the concept of adhesive free from cleaning,it has low dust and stable grinding performance.
Previous page
1
Next page
OFFICIAL ACCOUNTS
ONLINE MESSAGE
客户留言
Description:
All rights reserved©Jiangxi Ropan Technology Co., Ltd. Gan ICP No. 14006030
Gan public network security 36068102000111
Powered by www.300.cn