Back film tape
It is used to protect the front side (with circuit side) of the silicon wafer when grinding the back of the silicon wafer. The concept of adhesive design without cleaning works, with low dust and stable grinding.
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Keyword:
Low temperature cover tape Medium high temperature cover tape
- Product Description
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It is used to protect the front side (with circuit side) of the silicon wafer when grinding the back of the silicon wafer. The concept of adhesive design without cleaning works, with low dust and stable grinding.
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