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Low temperature cover tape
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It is a tape used in the cutting of various silicon wafers, packaging substrates, glass, crystal and other workpieces. By using ultraviolet rays, the adhesion is reduced, making it easier to peel off.
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It is used to protect the front side (with circuit side) of the silicon wafer when grinding the back of the silicon wafer. The concept of adhesive design without cleaning works, with low dust and stable grinding.
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Features: strong air barrier performance, anti-oxidation, waterproof, moisture-proof.
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Semiconductor tape has good bearing and protection
Semiconductor tape as an integral part of the semiconductor industry, then what are the specific advantages of semiconductor tape, we can understand the advantages of semiconductor tape through the following aspects.
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Narrow band features: round wheel machine, raw material PC PS, mold fixed, large output, meters long, more precise, higher requirements. (The bandwidth of 8mm and 12mm are customarily called narrow bands. The materials commonly used for such bands are PC, PE and PS)
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Carrier tape (Carrier Tape) refers to a belt-shaped product used in the field of electronic packaging. It has a specific thickness and is equidistantly distributed along its length with cavities (also known as pockets) for holding electronic components and positioning holes for index positioning. The carrier tape packaging has the advantages of low cost and high efficiency, and the automatic mechanical operation can be easily realized by using the carrier tape packaging. The shape and size of electronic components are different, and the material, size and structure of the carrier tape are also different. Generally, the carrier tape includes a chain hole conveying area for automatic transmission and a cavity for carrying electronic components. The upper and lower surfaces of the carrier tape are also attached with an upper sealing tape and a lower sealing tape for sealing components.
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